Advantest BGR-022365 A000824B-DED Board Module

Compatible with Advantest’s mainstream SoC/memory test platforms (e.g., T2000, V93000), it is used to implement multi-channel signal acquisition, high-precision measurement, protocol conversion and test command execution. It provides high-reliability and low-latency hardware support for the mass production testing of semiconductor devices (such as SoCs, MCUs and memory chips), and serves as a critical modular component for building high-density and high-throughput test systems.

Signal & Interface Capabilities

1. Multi-channel Input/OutputSupports parallel processing of analog signals (current/voltage, e.g., 4–20 mA, 0–10 V) and digital signals (TTL/CMOS discrete signals, high-speed differential signals). The channel count and precision are subject to test system configuration, which can adapt to the pin count and signal type requirements of different devices.
2. Communication InterfacesIntegrates industrial communication interfaces such as RS-485 and Ethernet, enabling high-speed data interaction with main controllers and test instruments. It is compatible with common bus protocols for ATE systems including GPIB and PCIe, realizing low-latency transmission for test command delivery and data readback.
3. Test InterfacesEquipped with dedicated test probe/socket interfaces for precise connection with Devices Under Test (DUT). Some configurations support hot-swapping (subject to system-level coordination), improving the efficiency of test model changeover.
   
   

Electrical & Environmental Parameters

1. Power SupplyCompatible with standard DC power supply of ATE systems (e.g., 24 V DC industrial power supply) and features low power consumption (typical value: 5 VA). It is built-in with over-current, over-voltage and reverse polarity protection functions to ensure the safety of the system and module.
2. Temperature Ranges
• Operating Temperature: -25°C to +60°C, meeting the requirements of industrial-grade wide-temperature operation.
• Storage Temperature: -40°C to +85°C, adapting to warehousing and transportation environments.
3. Anti-interference PerformanceComplies with IEC 61000 series electromagnetic compatibility standards and incorporates shielding design. It can operate stably in high-noise mass production test environments and ensure signal measurement accuracy.

Core Functions

1. Signal ProcessingPerforms filtering, amplification, sampling and calibration on analog/digital signals output by the DUT. It supports high-precision A/D and D/A conversion, satisfying the measurement requirements for parameters such as voltage, current and timing of semiconductor devices.
2. Test ControlReceives commands from the main test system to execute signal excitation, data acquisition and result judgment during the test process. It supports multi-thread parallel testing to improve test throughput.
3. Fault DiagnosisFeatures Board-Level Self-Test (BIST) function, which can monitor the status of power supply, interfaces and channels in real time and generate fault alarm information, facilitating rapid fault location and maintenance.

Application Scenarios & Compatible Systems

Core Application Fields

1. Semiconductor Mass Production TestingFactory acceptance testing for devices such as SoCs, microcontrollers (MCUs), memory chips (e.g., Flash, DRAM) and sensors, covering functional testing, performance testing and reliability testing.
2. Semiconductor R&D TestingUsed for prototype testing during the chip design verification phase, supporting rapid iteration of test schemes to optimize chip performance and yield.
3. Industrial Automation TestingAdapted to industrial equipment testing scenarios requiring high-precision signal processing and multi-channel control, such as module testing of automotive electronics and communication devices.

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