AMAT 0010‑24456 ESC Heated Pedestal Assembly | 300mm MCA Electrostatic Chuck
Overview
The AMAT 0010‑24456 ESC Heated Pedestal Assembly belongs to the 300mm MCA series electrostatic chuck assembly, a core wafer‑carrying component inside semiconductor vacuum process chambers.
Integrated with electrostatic clamping, multi‑zone heating, backside cooling gas channels and RF conduction structures, AMAT 0010‑24456 clamps and precisely temperature‑regulates 12‑inch silicon wafers under plasma environments for PVD and etch processes.
This unit fully incorporates ceramic dielectric layers, embedded heating circuits, temperature‑sensing points and helium cooling flow paths. No extra disassembly or assembly is required. It directly mates with corresponding process‑chamber electrical and fluid interfaces to guarantee wafer temperature uniformity and clamping stability during semiconductor manufacturing.
Technical Specifications
| Parameter Item | Specifications |
|---|---|
| Part Number | 0010‑24456 |
| Product Name | ESC Heated Pedestal Assembly |
| Compatible Wafer Size | 300mm (12‑inch) |
| Product Series | MCA ESC Heater Assembly |
| Substrate Dielectric | AlN Aluminum Nitride Ceramic |
| Temperature Control Mode | Multi‑zone resistive heating with built‑in temperature sensors |
| Operating Environment | High‑vacuum plasma chamber |
| Interface Type | RF interface, He backside cooling gas port, heating power connector, signal acquisition port |
| Clamping Method | Bipolar electrostatic chucking |
| Compatible Platform | AMAT Endura series process chambers |
Functional Advantages
- Integrated Assembly Design: AMAT 0010‑24456 combines electrostatic clamping and heated pedestal into one complete assembly, eliminating alignment deviation caused by on‑site assembly work.
- Multi‑Zone Thermal Uniformity: Multi‑zone heating architecture minimizes wafer‑level temperature delta and improves process consistency for thin‑film deposition and etch applications.
- Helium Backside Cooling Channel: Integrated helium back‑cool passages enable fast wafer heating and cooling via conductive gas, shortening process cycle waiting time.
- Reliable Bipolar Electrostatic Clamping: Bipolar electrostatic chuck firmly holds 300mm silicon wafers under vacuum, preventing wafer slippage or offset during high‑speed plasma processing.
- Standardized Interfaces for Easy Maintenance: Standard unified electrical and fluid interfaces simplify installation and service, reducing chamber downtime during maintenance events.
Plasma‑Resistant Ceramic Dielectric: Ceramic dielectric layer resists plasma erosion, supporting long‑term continuous mass‑production operation.
Product Features
- Monolithic Pedestal Assembly: Fine‑pattern gas grooves on the ceramic top surface distribute back‑side cooling gas evenly across the wafer backside.
- Embedded Heating & Sensing Layout: Pre‑embedded heating resistor traces and temperature sensing points feed real‑time platen temperature data back to the equipment control system.
- Vacuum‑Grade Back‑Side Construction: Pedestal rear side integrates bellows, RF conduction paths and sealed tubing connectors to satisfy high‑vacuum sealing requirements for process chambers.
- Plasma‑Resistant Surface Treatment: Platen surface receives plasma‑resistant finishing to lower accumulation rate of process by‑products.
- Precision Mechanical Matching: Tight mechanical tolerances match Endura chamber specifications; no extra shimming is required to correct flatness after installation.
- RF Bias Signal Transmission: Supports RF bias signal conduction to meet electrical requirements for plasma‑based semiconductor processes.
Application Fields
- 300 mm wafer PVD physical vapor deposition process chambers for semiconductor manufacturing
- Plasma dry etch chambers for integrated‑circuit fabrication
- Thin‑film processing vacuum equipment for memory‑chip production
- Multiple MCA process modules within the AMAT Endura platform
- Vacuum processing chambers for semiconductor R&D and pilot‑production lines
Product Comparison
- Vs 0010‑27983: Both are 300 mm MCA ESC heaters. AMAT 0010‑24456 is a full assembly including pedestal, bellows and tubing connectors. 0010‑27983 mainly supplies the ceramic heater chuck body without some rear‑side mechanical components.
- Vs 200 mm ESC Units: AMAT 0010‑24456 targets 12‑inch large‑format wafers with more heating zones and optimized gas‑channel layout for superior thermal uniformity on larger substrates.
Vs Non‑Heated Standard ESC: Ordinary non‑heated electrostatic chucks only perform wafer clamping. AMAT 0010‑24456 delivers both clamping function plus high‑precision temperature control, suited for temperature‑sensitive deposition and etch recipes.
Related Spare Parts
- Equipment Chamber Module: AMAT Endura MCA process chamber module
- Matching Controller: 0190‑23942 ESC high‑voltage control unit for electrostatic clamping voltage output
- RF Matching Unit: 0010‑20442 RF matcher to supply RF bias signals to the chamber
- Helium Flow Control Component: 0010‑12860 backside cooling lift assembly to regulate helium cooling‑gas flow
- Chamber Lift‑Pin Assembly: 0010‑00938, works with ESC pedestal for wafer transfer and hand‑off
Recommended Related AMAT Part Numbers
- 0010‑27983 | 300mm MCA E‑Chuck ESC Heater
- 0010‑27430 | 300mm MCA ESC Assembly
- 0010‑16001 | 200mm ESC Heater Pedestal Assembly
- 0010‑00938 | 200MM FLAT DUAL ZONE ESC ASSY
- 0190‑23942 | ESC High‑Voltage Control Unit
- 0010‑24774 | 300mm ESC Heater Assembly
- 0010‑53618 | MCA ESC Heating Base
- 0010‑59787 | 300mm ESC Chuck Assembly
- 0010‑56222 | Heater ESC Assembly
- 0010‑62632 | 300mm MCA ESC Component
- 0010‑81296 | ESC Heater Pedestal
- 0040‑49519 | ESC Ceramic Pad Assembly
- 0010‑12860 | Heater Lift Assy
- 0010‑20442 | 8 Inch RF Match Assy
- 0190‑25087 | ESC Controller Module
FAQ
Q: What are common root causes for temperature alarms after installing AMAT 0010‑24456?
A: Typical causes include heating‑circuit resistance drift, micro‑leaks in back‑side helium lines, aged temperature‑sensor points, or hidden cracks within the ceramic layer. Off‑line resistance testing and gas‑tightness inspection are recommended prior to chamber installation.
Q: Can 0010‑24456 directly replace 0010‑27983 on tool?
A: Direct swap is not supported. Mechanical assembly and rear‑side bellows structures differ significantly. Only the ceramic chuck body shares partial process‑related specifications. Evaluate mechanical interface compatibility before any replacement attempt.
Q: What is the typical lead time for purchasing 0010‑24456?
A: In‑stock units can ship quickly. Lead‑time for out‑of‑stock items depends on overseas supply‑chain logistics. Exact estimated lead time will be provided upon order placement.
Q: Can I continue production if black discoloration appears on the ESC platen surface?
A: Surface blackening indicates plasma erosion and accumulated process by‑products. Thermal uniformity and electrostatic clamping force will degrade. Mass‑production operation is not advised. Evaluate surface refurbishment or direct component replacement.
Q: Which incoming inspections should be performed after receiving 0010‑24456?
A: Verify multi‑zone heating resistance values, electrostatic clamping insulation performance, helium‑circuit gas tightness, ceramic surface for chipping or cracks, and dimensional interface conformity.
Q: Which tool revisions are compatible with 0010‑24456?
A: Primarily fits AMAT Endura platform MCA 300 mm process modules. Always provide exact chamber revision number during ordering to prevent interface mismatch.
Q: What is the key difference between 0010‑24456 and generic electrostatic chucks?
A: 0010‑24456 is a complete integrated heated pedestal assembly with multi‑zone heating and built‑in back‑side cooling gas channels. Conventional ESC only provides electrostatic wafer clamping without integrated heating, and cannot satisfy high‑precision temperature‑controlled process recipes.
Product Tags
