Model 8116071G001 is an on-board 8F cryopump compatible with Applied Materials’ ENHANCED ENDURA 300mm high-pressure physical vapor deposition (HP PVD) system. Manufactured by CTI-Cryogenics as a supporting component, it features a three-phase power supply design and is engineered exclusively for semiconductor metal deposition processes.
This unit integrates an all-in-one control module and adopts a closed-loop helium refrigeration cycle, enabling rapid establishment of an ultra-high vacuum environment with superior cleanliness. Optimized for mass-production 300mm wafer fabrication lines, it serves as the standard vacuum generation component for Endura HP PVD chambers. Leveraging fast regeneration technology, it minimizes equipment downtime and ensures consistent stability and throughput for wafer thin-film coating processes.
Technical Features
Airborne integrated integrated structure; no additional external control box required, enabling direct communication with the Endura equipment bus.
Three-phase industrial power supply compatible with standard power distribution for production lines, delivering stable power load and wider tolerance range for voltage fluctuations.
8F-sized cold head with a water vapor pumping speed of 4000 L/s and an air pumping speed of 1500 L/s, meeting pumping requirements for high-flow process gases.
Two-stage refrigeration structure: the primary cold screen operates at approximately 80K to condense water vapor and carbon dioxide; the secondary cold plate works at 10K to condense process gases such as nitrogen and argon.
An embedded microprocessor provides full-range monitoring of pump body temperature, helium pressure and regeneration progress, supporting automatic fault diagnosis and remote data upload.
Synchronized regeneration logic for multiple coordinated pumps allows batch regeneration of cryopumps in multi-chamber equipment, preventing full equipment shutdown caused by single-pump regeneration.
10-inch ConFlat standard flange with copper gasket sealing delivers ultra-high vacuum sealing performance. Oil-free vacuum generation eliminates oil contamination risks to wafer process chambers.
An enhanced refrigeration circuit drastically shortens cold-to-cold regeneration cycles and improves production line uptime.
Product Features
Excellent vacuum cleanliness. Free of lubricating oil and mechanical friction parts, it generates no hydrocarbon contaminants, suitable for high-cleanliness semiconductor processes including Ti, Al, Cu metal sputtering deposition.
Ultimate vacuum reaches the order of 10⁻⁷ Torr, meeting the uniform thin-film deposition requirements for advanced 300mm wafer manufacturing processes.
Designed for continuous mass-production operation. It can run continuously for hundreds of hours with fully automatic regeneration procedures requiring no manual intervention.
Fully compatible with the native control system of Endura equipment with perfectly matched signal protocols. Equipment linkage control is realized without additional conversion modules.
Compact and lightweight structure. On-board installation saves layout space in cleanrooms. Equipped with a universal rotary flange joint for easy alignment during installation.
Comes with a dedicated helium compressor unit. The closed-loop helium circulation features zero leakage and loss, maintaining stable refrigeration performance without attenuation during long-term operation.
Application Fields
Semiconductor Wafer Fabrication: High-pressure PVD metal sputtering processes for 300mm ENHANCED ENDURA systems, covering deposition of titanium barrier layers, aluminum interconnects and copper seed layers.
Advanced IC Manufacturing: Metal thin-film deposition processes for logic chips and memory chips.
Vacuum Coating Industry: Vacuum source supporting vacuum deposition equipment for ultra-clean metallic films and optical coatings.
Scientific Research Vacuum Equipment: Vacuum generation components for ultra-high vacuum surface analysis and molecular beam epitaxy (MBE) systems.
Frequently Asked Questions
Q1 Is the 8116071G001 cryopump compatible with older 200mm Endura systems?A1 Direct compatibility is not supported. This model features an on-board structure with three-phase power supply, while legacy 200mm Endura equipment adopts single-phase power distribution. Mismatches exist in equipment control bus protocols and flange mounting dimensions, and no conversion or retrofitting solution is available.
Q2 What impacts will shorter cryopump regeneration cycles bring to wafer coating processes?A2 Shortened regeneration cycles reduce the gas adsorption capacity per cycle, easily causing fluctuations in chamber vacuum during processing and deteriorating thin-film thickness uniformity. Frequent regeneration also increases thermal cycling wear on the refrigeration circuit and shortens pump service life. It is recommended to strictly follow the standard preset regeneration duration of the equipment.
Q3 Which components should be prioritized for troubleshooting if the chamber vacuum continuously degrades during operation?A3 Four priority inspection items are listed as follows:
- Check whether the copper gasket of the 10-inch CF flange is deformed or oxidized to cause sealing leakage;
- Test the helium compressor pressure to confirm no helium leakage in the refrigeration circuit;
- Read the temperature sensor value of the secondary cold plate of the cryopump to identify refrigeration efficiency attenuation;
- Verify the pumping performance of the roughing pump to ensure no accumulation of residual regenerated gas.
Q4 What are the core differences between this cryopump and the 8116081G006 8F cryopump?A4 The core distinctions lie in compatible platforms and power supply specifications. Model 8116081G006 fits standard conventional Endura equipment with single-phase power supply. Model 8116071G001 matches enhanced ENHANCED Endura platforms with three-phase industrial power supply. Its internal control program is optimized for high-pressure metal sputtering processes, and the two models cannot be directly interchanged.
Q5 What environmental requirements must be met for storing idle cryopumps in cleanrooms?A5 The storage space must maintain Class 10,000 or higher cleanroom standards, with ambient temperature kept at 18–26°C and relative humidity below 40%. Protective cover plates shall be installed on flange sealing surfaces, and the pump interior shall be sealed with high-purity nitrogen. Long-term storage in areas with high concentrations of acid, alkali, dust or water vapor is prohibited. Refill nitrogen protection every 3 months.
Recommended Product Models of the Same Series
8116071G001, On-Board 8F Three-Phase Enhanced Cryopump8116081G006, On-Board 8F Single-Phase Standard Cryopump8116030G001, On-Board 4F On-Board Cryopump8116167G001, On-Board 250F Etching-Specific Cryopump8116292G001, On-Board 10F Ion Implantation Cryopump8116250G001, On-Board P300 300mm General Cryopump8185095G001R, IS-8F Refurbished On-Board Cryopump0190-13369R, AMAT Matching 8F Cryopump Assembly8043156G600, Cryopump Helium Return Pipeline Assembly0190-27355R, ENDURA IMP Process Chamber Cryopump8135900G001, Series 9600 Helium Compressor8032559G001, Series 8200 Helium Compressor0190-16398, Endura HP PVD 8F Cryopump Spare Parts Kit
3005319639